THERMAL.PAD.ON.CHIP.BOARD.MODULE
THERMAL.PAD.ON.CHIP.BOARD.MODULE - 47.JNWJ3.007
Availability:
Available for back order, eta to be confirmed.
SKU: 47.JNWJ3.007
R 127.65 incl.
R 111.00 excl.
OR
R 12.00 p/m x 12 months
with mobicred
Description
Product
HARDWARE.MISC.