HEATSINK MODULE W/THERMAL PAD

HEATSINK MODULE W/THERMAL PAD - 24.H0VN8.001

Availability: Available for back order, eta to be confirmed.

SKU: 24.H0VN8.001

R 250.70 _incl.

R 218.00 _excl.

_OR

R 24.00 _{p/m x 12 months}

_{with mobicred}

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Description

HARDWARE.COOLING

Mobicred