HEATSINK.MODULE.W/THERMAL.PAD

HEATSINK.MODULE.W/THERMAL.PAD - 24.H0VN8.001

Availability: Available for back order, eta to be confirmed.

SKU: 24.H0VN8.001

R 250.47 _incl.

R 217.80 _excl.

_OR

R 24.00 _{p/m x 12 months}

_{with mobicred}

Learn More

Description

HARDWARE.COOLING

Mobicred